formerly University of Missouri-Rolla

 

Intelligent Systems Center
320 Engineering Research Lab
500 W. 16th St.
Rolla, MO 65409-0440
Phone : (573) 341-4350
Fax: (573) 341-6512

E-mail: mleu@mst.edu

Die Repair Using Direct Metal Deposition Process

die repair

Investigators:

Frank Liou (liou@mst.edu, 573-341-4603)

 

Funding Source:

Spartan Light Metal Products, Inc.

Project Description:

The objective of this proposed project is to investigate the microstructure and mechanical properties of parts, such as bonding strength and thermal conductivity, for die repairing using direct metal deposition. A process which integrates direct metal deposition and CNC machining at the Missouri University of Science and Technology(Missouri S&T) LAMP lab will be used to study the die repair.

 

Web link for this project:

http://web.mst.edu/~lamp

Publications:

1. Kannayut Eiamsa-ard, Hari Janardanan Nair, Lan Ren, Jianzhong Ruan, Todd Sparks, Frank Liou, �Part Repair Using a Hybrid Manufacturing System,� Proceedings of the Sixteenth Annual Solid Freeform Fabrication Symposium, Austin, Texas, August 1-3, 2005. (Won best poster paper award in the 2005 SFF Conference, Austin, Texas)

Abstract: Nowadays, part repair technology is gaining more interest from military and industries due to the benefit of cost reducing as well as time and energy saving. Traditionally, part repair is done in the repair department using welding process. The limitations of the traditional welding process are becoming more and more noticeable when the accuracy and reliability are required. Part repair process has been developed utilizing a hybrid manufacturing system, in which the laser aided deposition and CNC cutting processes are integrated. Part repair software is developed in order to facilitate the users. The system and the software elevate the repair process to the next level, in which the accuracy, reliability, and efficiency can be achieved. The concept of repair process is presented in this paper. Verification and experimental results are also discussed.